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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot air

QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot air

Name: QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot air
Brand: nyherosfund.org
SKU: 20192537836
Price: 15.40 USD
Availability: InStock
Rating: 4.3033 (28 reviews)

SKU: 20192537836

4.3

DKK15.40 DKK36.40

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Ships within 48 hours · Estimated delivery Aug 26 - Aug 31

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QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582 Options:EMMC General DDR WYLIE 850A+ pump hot airProduct introduction: QianLi Toolplus Black stencil makes positioning your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil. Details: DESIGN Designed to help with repairsDURABLE Easy to work withSIZE Standard size3D Better positioning Product Features: 1. Square hole technology2. Toughness, high temperature resistance and deformation3. New upgrade and

Store: nyherosfund.org · Domain: nyherosfund.org

Description

WYLIE 850A+ pump hot air 850A+ hot air gun rifle crack 850A+ air gun

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