BURNDYWELD BCC-2 B232 10047340 NSMP M720t 5-inch SFF form factor compatible

5-inch SFF form factor compatible with HP ProLiant BL/DL/ML/SL G4–G7 series and HP D2700

Record results directly to your phone and the Cloud

Utilizing advanced 3D NAND Flash technology

The HP 647877-B21 8GB PC3L-10600R DDR3-1333 2RX4 ECC memory module is designed to deliver reliable and efficient performance for enterprise-level computing environments

BURNDYWELD BCC-2 B232 10047340 NSMP M720t 5-inch SFF form factor compatibleThe Burndy BCC 2 is a genuine exothermic weld mold. It is supplied New Surplus in the original manufacturer packaging (NSMP). Manufacturer: Burndy MPN: BCC 2 Type: Exothermic weld mold Condition: NSMP New Surplus Manufacturer Package Shipped worldwide DDP all duties, taxes and broker fees included. Purchase Orders accepted.